US Patent 7135767 Integrated circuit substrate material and method
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Patent Inventor Names
Arthur Fong0
Marvin Glenn Wong0
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Patent abstract
A semiconductor substrate is presented which is manufactured from hollow, gas-filled glass or ceramic microspheres, which are bound together in a dried or fired matrix. The microspheres may be glass-coated microspheres, which are bound together by sintering the outer layers of glass together. The semiconductor surface may be smoothed by glazing the surface.
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US Patent 07135767 Integrated circuit substrate material and method US Patent 7135767 Integrated circuit substrate material and method
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Patent Number
071357670
Patent Number
71357670
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Patent Jurisdiction
Patent Number
071357670
Date of Patent
November 14, 2006
0Patent Application Number
106292710
Date Filed
July 29, 2003
0Official Website
Patent Primary Examiner
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US Patent 07135767 Integrated circuit substrate material and method
Infobox
Is a
Patent jurisdiction
Patent number
07135767
Date of patent
November 14, 2006
Patent application number
10629271
Date Filed
July 29, 2003
Patent primary examiner
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