Patent 7136564 was granted and assigned to Xponent Photonics, Inc. on November, 2006 by the United States Patent and Trademark Office.
Formation of a substantially flat upper cladding surface over a waveguide core facilitates transverse-coupling between assembled waveguides, and/or provides mechanical alignment and/or support. An embedding medium may be employed for securing optical assemblies and protecting optical surfaces thereof. Structural elements fabricated with a low-profile core may be employed for providing mechanical alignment and/or support, aiding in the encapsulation process, and so forth.