Patent attributes
An interface to make interconnections between the interior and exterior of a sealed enclosure may include a flat connector (FC). The FC may comprise at least one layer of a substantially planar substrate. Each substrate layer may include metallization for conducting signals between contacts on an interior-facing surface and contacts on an exterior-facing surface. In an enclosure with an aperture for passing electrical conductors, the FC may be configured to seal the aperture to inhibit the escape of a low density gas, such as helium, for a long period of time. In one embodiment, the FC may include metallization configured to minimize helium leakage. As such, the FC may conduct electrical signals into and out of the sealed enclosure. Such signals may include, for example, power, control, and data signals for operating devices housed within the enclosure.
