Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hitoshi Nagayama0
Yusuke Inoue0
Date of Patent
November 21, 2006
0Patent Application Number
113594510
Date Filed
February 23, 2006
0Patent Primary Examiner
Patent abstract
The object of the present invention is to provide a thickness control method for a double side polisher, accuracy of which is not affected by wearing of polishing pad and applicable to polishing of nonconductive work pieces. An eddy current sensor in a cavity of an upper polishing plate measures distance from the senor to the upper surface of carrier with holes for the work pieces being inserted respectively. The measured distance is successively monitored and polishing is stopped when the distance has become a predetermined value corresponding to target amount of material removal from the work piece.
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