US Patent 7138174 Prepreg and a laminated sheet

Patent 7138174 was granted and assigned to Hitachi on November, 2006 by the United States Patent and Trademark Office.

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US Patent RE49929 Substrate for high-frequency printed wiring board

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Patent Inventor Names

Kazumasa Takeuchi0

Yuko Tanaka0

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Patent abstract

The present invention is directed to a prepreg comprising a fiber base material impregnated with a resin composition which comprises a polyamide-imide resin and a thermosetting resin as essential components, and a metal-clad laminated sheet obtained by pressing the prepreg and a metal foil having a surface roughness: Rz≦3.0 together while heating. In addition, the present invention provides a heat-resistant laminated sheet which is excellent in micro-wiring formation properties, thermal shock resistance, reflow resistance, and crack resistance.

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