US Patent 7138667 High power light emitting diode

An LED package is disclosed. The LED package comprises a base contact and a leadframe connected to the base contact. The leadframe includes an annular contact. An LED die is coupled to the base contact and the annular contact. A trim bezel is coupled to the leadframe. In various embodiments the LED package may include a lens, and an optical material disposed over the LED die. The trim bezel may be colored to generally indicate the color of light emitted by the LED die.