US Patent 7138723 Deformable semiconductor device
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Patent Inventor Names
Akira Takashima0
Kaname Ozawa0
Kazuyuki Aiba0
Takaaki Suzuki0
Tetsuya Hiraoka0
Yasurou Matsuzaki0
Edits on 31 Aug, 2023
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Patent abstract
A semiconductor chip is secured in a state deformed into a substantially cylinder shape by a coating material formed on its surface. The deformed semiconductor chip is flip-chip connected to an interposer and sealed with sealing resin onto the interposer. Solder balls are provided, as external terminals, on the other side of the interposer.
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US Patent 07138723 Deformable semiconductor device US Patent 7138723 Deformable semiconductor device
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Patent Number
071387230
Patent Number
71387230
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Official Website
Edits on 31 Mar, 2023
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Infobox
Is a
Patent Jurisdiction
Patent Number
071387230
Date of Patent
November 21, 2006
0Patent Application Number
110066640
Date Filed
December 8, 2004
0Official Website
Patent Primary Examiner
Edits on 8 Jun, 2022
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Edits on 19 Nov, 2021
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US Patent 07138723 Deformable semiconductor device
Infobox
Is a
Patent jurisdiction
Patent number
07138723
Date of patent
November 21, 2006
Patent application number
11006664
Date Filed
December 8, 2004
Patent primary examiner
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