Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 28, 2006
Patent Application Number
10234498
Date Filed
September 3, 2002
Patent Primary Examiner
Patent abstract
Materials bonded together are separated using electrical current, thermal stresses, mechanical force, any combination of the above methods, or any other application or removal of energy until the bonds disappear and the materials are separated. In one embodiment the original bonding was composed of two layers of material. In another embodiment, the sandwich was composed of three layers. In a further embodiment, the parts of the sandwich are firmly maintained in their respective positions during the application of current so as to be able to subsequently align the materials relative to one another.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.