Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Nick Lin0
Yu-Chen Chen0
Date of Patent
November 28, 2006
Patent Application Number
11293972
Date Filed
December 5, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
Disclosed is a BGA connector assembly including an insulative housing (11) with a plurality of terminals (15) in electrical connection with corresponding solder balls (3) that extend from a surface of the housing. The solder balls form a soldering region (30) for attachment to a printed circuit board. The whole electrical connector assembly has a center of gravity biased from a center of the soldering region, and at least one recess (111) is formed in the housing. The at least one recess prevents the connector assembly from becoming inclined with respect to the printed circuit board when the solder balls are attached to the printed circuit board.
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