US Patent 7140955 Polishing apparatus

A polishing apparatus includes a plurality of polishing fluid supply openings terminating in a polishing surface of a polishing table, and a plurality of grooves which are formed in the polishing surface and arranged so as not to be in direct communication with the polishing fluid supply openings. The polishing apparatus further includes a polishing fluid supply system for supplying a polishing fluid to a surface of a substrate through the openings. The grooves may extend at right angles relative to one another so as to define a plurality of lands therebetween, and the polishing fluid supply openings are formed through the lands.