Patent attributes
Improved means for powering and increasing evaporative cooling in an indirect-direct evaporative cooling (IDEC) apparatus are disclosed. Sustainable energy from solar energy mixed with grid power, when needed, power the IDEC device. These DC and AC power sources are seamlessly merged in a unique diode interconnect unit. Improved means for evaporative cooling include a rayon-based flocking on the wet side of molded plastic indirect evaporative cooling plates. Separate wet and dry passages through those plates are facilitated by a unique means for clamping the upper ends of the plates. These clamping means also add to the structural integrity of an array of plates so that the array can be inserted in and removed from a housing containing other operational components of the IDEC such as fan, direct cooling plates and water distribution means. Applicants IDEC utilizes improved porous piping that allows uniform and continuous distribution of water to all wet passages within both the indirect and direct stages of the IDEC. Operational controls for the system limit the potential water damage caused by overflow of water from the IDEC housing.
