Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takashi Kunimatsu0
Minoru Fukui0
Date of Patent
December 5, 2006
Patent Application Number
10423944
Date Filed
April 28, 2003
Patent Primary Examiner
Patent abstract
The semiconductor device of this invention includes a first die pad down-set away from boundary portions between inner lead portions and outer lead portions; a first semiconductor chip mounted on the first die pad; a chip-shaped electronic component with a small thickness mounted on a second die pad formed by increasing the width of at least one of the inner lead portions; metal wires; leads each having an inner lead portion and an outer lead portion; and an encapsulation resin part for encapsulating the die pads, the semiconductor chip, the chip-shaped electronic component, the inner lead portions and the metal wires.
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