Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
December 12, 2006
Patent Application Number
10897706
Date Filed
July 22, 2004
Patent Primary Examiner
Patent abstract
A die attachment includes a placement head, a platen, and a vibration mechanism to vibrate at least a selected one of the placement head and platen while a die and a substrate mounted on the placement head and the platen, respectively, are in contact.
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