Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Toshio Shiobara0
Hideki Akiba0
Masachika Yoshino0
Nobuhiro Ichiroku0
Date of Patent
December 12, 2006
0Patent Application Number
107131630
Date Filed
November 17, 2003
0Patent Primary Examiner
Patent abstract
In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.
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