Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yasuhiro Koshio0
Hiroshi Funakura0
Masatoshi Fukuda0
Mitsuru Oida0
Date of Patent
December 12, 2006
0Patent Application Number
101011080
Date Filed
March 20, 2002
0Patent Primary Examiner
Patent abstract
A semiconductor package includes (a) an interposer, (b) a wiring layer containing conductors formed adjacent to each other at intervals that cause no short circuit among the conductors, the wiring layer covering a given area of the interposer, to block light from passing through the given area, (c) a light blocking layer covering a no-wiring area of the interposer not covered by the wiring layer, to block light from passing through the no-wiring area, (d) a semiconductor chip electrically connected to the wiring layer, and (e) a resin mold sealing the wiring layer, the light blocking layer, and the semiconductor chip.
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