Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Daisuke Iguchi0
Date of Patent
December 12, 2006
0Patent Application Number
108283070
Date Filed
April 21, 2004
0Patent Primary Examiner
Patent abstract
In a printed circuit board of the invention, a first signal wiring layer, a first ground layer, a second ground layer and a second signal wiring layer are laminated via an insulating material. A first signal wiring is formed on the first signal wiring layer and a second signal wiring is formed on the second signal wiring layer. The two signal wirings are connected via a first through hole. The conductive first ground layer and the conductive second ground layer are connected via a second through hole. The second through hole is insulated from the first through hole and formed so as to surround the first through hole.
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