Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takashi Hasegawa0
Date of Patent
December 19, 2006
0Patent Application Number
103704660
Date Filed
February 24, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A sputtering target includes a backing plate, a copper target provided on the backing plate, and a protection layer formed of a corrosion-resistant metal on the surface of the copper target The protection layer depresses oxidation of the copper target and the adhesion of particles to a substrate due to the release of a deposited layer on the surface of the shielding plate.
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