Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 19, 2006
Patent Application Number
10243487
Date Filed
September 13, 2002
Patent Primary Examiner
Patent abstract
A package for housing a device (e.g., an integrated circuit chip or die) includes a Faraday cage. The Faraday cage is at least partially formed in the integrated circuit die. The die includes conductive vias and solder balls surrounding a circuit. The package can be a ball grid array (BGA) package or flip chip package. The package substrate can include a ground plane.
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