US Patent 7151049 Electroplating compositions and methods
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Patent abstract
Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
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US Patent 07151049 Electroplating compositions and methods US Patent 7151049 Electroplating compositions and methods
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Patent Number
0715104900
Patent Number
715104900
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Official Website
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Infobox
Is a
Patent Jurisdiction
Patent Number
071510490
Date of Patent
December 19, 2006
0Patent Application Number
108166270
Date Filed
April 2, 2004
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Patent Jurisdiction
Patent Number
071510490
Date of Patent
December 19, 2006
0Patent Application Number
108166270
Date Filed
April 2, 2004
0Official Website
Patent Primary Examiner
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US Patent 07151049 Electroplating compositions and methods
Infobox
Is a
Patent jurisdiction
Patent number
07151049
Date of patent
December 19, 2006
Patent application number
10816627
Date Filed
April 2, 2004
Patent primary examiner
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