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US Patent 7153775 Conductive material patterning methods

Patent 7153775 was granted and assigned to Micron Technology on December, 2006 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
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Current Assignee
Micron Technology
Micron Technology
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Date Filed
August 30, 2005
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Date of Patent
December 26, 2006
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Patent Application Number
11215465
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Patent Citations Received
‌
US Patent 11950387 Methods for forming hermetically-sealed packages including feedthrough assemblies
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‌
US Patent 11744518 Sealed package and method of forming same
Patent Inventor Names
Alan R. Reinberg
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Joseph E. Geusic
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
7153775
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Patent Primary Examiner
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Thanhha S. Pham
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