Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kevin Kwong-Tai Chung0
Date of Patent
December 26, 2006
0Patent Application Number
107748820
Date Filed
February 9, 2004
0Patent Primary Examiner
Patent abstract
A molecularly flexible dielectric electronic substrate for receiving an electronic device has a modulus of elasticity less tan about 500,000 psi. The molecularly flexible dielectric substrate comprises one or more sheets or layers of a molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi and having patterned metal foil electrical conductors thereon. The molecularly flexible dielectric adhesive may have a low glass transition temperature and the ability to withstand soldering.
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