Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
December 26, 2006
Patent Application Number
10714277
Date Filed
November 14, 2003
Patent Primary Examiner
Patent abstract
A microelectronic structure having a substrate of multiple conductive bumps for contact with bond pads on an electronic substrate in the fabrication of a flip chip electronic assembly. Each of the conductive bumps includes a conductive layer which is absent from at least one sidewall of the bump to prevent the inadvertent formation of a short-circuiting electrical path between adjacent conductive bumps in the electronic assembly.
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