Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 26, 2006
Patent Application Number
10718191
Date Filed
November 20, 2003
Patent Primary Examiner
Patent abstract
A method for encapsulating an integrated circuit chip is described. An intergrated circuit chip is attached to a substrate; a stress buffering material only covers corners of the integrated circuit chip; and an encapsulation material coats the integated circuit chip and a portion of the substrate.
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