US Patent 7156640 Insert dies, molds, and methods for fabricating the same

Patent 7156640 was granted and assigned to Seiko Epson on January, 2007 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Seiko Epson

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

71566400

Patent Inventor Names

Satoshi Kimura0

Noboru Furuya0

Date of Patent

January 2, 2007

Patent Application Number

110230950

Date Filed

December 22, 2004

Patent Primary Examiner

‌

James P Mackey

Patent abstract

A method for manufacturing an insert die with a pattern region to be transferred onto a molding part is provided. The method includes (a) adhering a first base member having the pattern region and a second base member with an adhesive material, and (b) sealing an exposed portion of the adhesive material by a metal film.

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