Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Nobuyuki Suzuki0
Hiroyuki Yatsu0
Date of Patent
January 2, 2007
0Patent Application Number
110206180
Date Filed
December 21, 2004
0Patent Primary Examiner
Patent abstract
An electronic circuit unit contains electrodes to which bumps of a semiconductor chip are adhered. The electrodes are arranged on an upper surface of a circuit board. Land units to which chip parts is soldered are arranged on a rear surface of the circuit board. such that an insulating plate which is on the rear surface of the circuit board is supported by a supporting jig during a mounting process of the semiconductor chip, and the circuit board is not tilted. Therefore, an electronic circuit unit ensuring that the semiconductor chip is mounted with a reliable mounting capability can be obtained.
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