Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Salman Akram0
Date of Patent
January 2, 2007
0Patent Application Number
109713920
Date Filed
October 21, 2004
0Patent Primary Examiner
Patent abstract
Metal traces and solder bump pads are formed on a semiconductor substrate by way of a semiconductor template that has been micromachined to receive solder paste material. The solder paste material is then formed into precisely controlled ball shapes and metal trace geometries.
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