Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yuji Takada0
Masahiro Kodoh0
Masato Shinotani0
Ryo Taniguchi0
Atsushi Hironaka0
Hisanobu Tanaka0
Date of Patent
January 2, 2007
0Patent Application Number
104844060
Date Filed
June 24, 2003
0Patent Primary Examiner
Patent abstract
An infrared sensor package has a dielectric support which is molded from a plastic material to have a sensor mount for securing a pyroelectric element as well as an IC mount for securing an IC chip that processes a signal from the pyroelectric element. The support is molded over to be integral with metal parts. The metal parts include sensor conductors for interconnection of the pyroelectric element with the IC chip, and I/O conductors for interconnection of the IC chip with I/O pins. The sensor conductors as well as the I/O conductors are both molded into and integrally with the dielectric support.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
