Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wai Yew Lo0
Cheng Choi Yong0
Kong Bee Tiu0
Date of Patent
January 9, 2007
Patent Application Number
11108220
Date Filed
April 18, 2005
Patent Primary Examiner
Patent abstract
A method of forming a substrateless semiconductor package (10) includes forming a carrier (16) on a base plate (12) and attaching an integrated circuit (IC) die (32) to the carrier (16). The IC die (32) then is electrically connected to the carrier (16). A molding operation is performed to encapsulate the IC die (32), the electrical connections (36) and the carrier (16). Thereafter, the base plate (12) is removed.
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