US Patent 7161237 Flip chip packaging using recessed interposer terminals
Patent 7161237 was granted and assigned to Micron Technology on January, 2007 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
May 17, 2002
0
Date of Patent
January 9, 2007
0
Patent Application Number
10150653
0
Patent Inventor Names
Teck Kheng Lee
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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