Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Nobuaki Nakayama0
Shuhei Ishikawa0
Takahiro Ishikawa0
Kazuyoshi Inoue0
Makoto Miyahara0
Masayuki Shinkai0
Date of Patent
January 9, 2007
0Patent Application Number
107838920
Date Filed
February 20, 2004
0Patent Primary Examiner
Patent abstract
A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.
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