Patent attributes
The object is the capability of providing a method of manufacturing mounting boards that enables extensive adoption of a stacked structure at a low cost. As a solution, in the method of manufacturing a mounting board in which a mounting board is manufactured by mounting a first electronic part 11 and a second electronic part 12 each having a solder bump in its bottom plane on a substrate 3 in stacked plural levels, after the first electronic part 11 is mounted on the substrate 3 that has been fed with solder, the solder bump 18 of the second electronic part 12 is mounted on the electrode 17 provided on the upper plane of the first electronic part 11, and thereafter the substrate 3 is heated in a reflow step to solder-bond the first electronic part 11 to substrate 3 along with solder-bonding the second electronic part 12 to the first electronic part 11. By such process, a stacked structure can be applied to a wide variety of electronic parts at a low cost.
