US Patent 7163437 System with sealed polishing pad

Patent 7163437 was granted and assigned to Applied Materials on January, 2007 by the United States Patent and Trademark Office.

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Patent Inventor Names

Bogdan Swedek0

David J. Lischka0

Dominic J. Benvegnu0

Jeffrey Drue David0

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edited on 31 Aug, 2023

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Patent abstract

A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a sealant that penetrates a second portion of the backing layer adjacent to and surrounding the aperture such that the second portion is substantially impermeable to liquid. The aperture is positioned below a substantially fluid-impermeable element.

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Official Website

https://pdfpiw.uspto.gov/.piw?Docid=071634370

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