Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chia Hua Wang0
Date of Patent
January 23, 2007
0Patent Application Number
109320940
Date Filed
September 2, 2004
0Patent Primary Examiner
Patent abstract
The present invention provides a heat sink structure, which includes: a housing located on a material with low thermal conductivity; and a heat conductor placed inside the housing. At least one air gap is formed between the heat conductor and the housing to reduce the conductivity from the heat conductor to the housing, and thus increasing the thermal resistance between the heat conductor and the housing. The surface temperature of the bottom of the housing thus could be reduced and averaged, so as to effectively improve the lifespan, the safety and reliability of a device with the heat sink structure.
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