Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Anthony D. Minervini0
Date of Patent
January 23, 2007
0Patent Application Number
098868540
Date Filed
June 21, 2001
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, a substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
