US Patent 7166924 Electronic packages with dice landed on wire bonds
Patent 7166924 was granted and assigned to Intel on January, 2007 by the United States Patent and Trademark Office.
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Patent Inventor Names
Charles A. Gealer0
Jicun Lu0
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Article (+168 characters)
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Patent abstract
A stacked dice electronic package without spacers between the dice and where an overlying die is landed on wire bonds of the underlying die is disclosed.
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Official Website
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US Patent 07166924 Electronic packages with dice landed on wire bonds US Patent 7166924 Electronic packages with dice landed on wire bonds
Infobox
Patent Number
071669240
Patent Number
71669240
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
071669240
Date of Patent
January 23, 2007
0Patent Application Number
109210140
Date Filed
August 17, 2004
0Official Website
Patent Primary Examiner
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US Patent 07166924 Electronic packages with dice landed on wire bonds
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07166924
Date of patent
January 23, 2007
Patent application number
10921014
Date Filed
August 17, 2004
Patent primary examiner
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