US Patent 7168796 Printhead assembly with thermal equalization characteristics
All edits
Edits on 6 Sep, 2023
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Inventor Names
Kia Silverbrook0
Edits on 31 Aug, 2023
Golden AI
Edits made to:
Article (+342 characters)
Article
Patent abstract
A printhead assembly includes a support member of a composite material that defines at least one ink reservoir. A printhead integrated circuit is mounted on the support member. A substrate material of the printhead integrated circuit and the composite material both have substantially the same coefficient of thermal expansion.
Edits on 22 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07168796 Printhead assembly with thermal equalization characteristics US Patent 7168796 Printhead assembly with thermal equalization characteristics
Infobox
Patent Number
071687960
Patent Number
71687960
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
071687960
Date of Patent
January 30, 2007
0Patent Application Number
112504510
Date Filed
October 17, 2005
0Official Website
Patent Primary Examiner
Edits on 8 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 20 Nov, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07168796 Printhead assembly with thermal equalization characteristics
Infobox
Is a
Patent jurisdiction
Patent number
07168796
Date of patent
January 30, 2007
Patent application number
11250451
Date Filed
October 17, 2005
Patent primary examiner
Find more entities like US Patent 7168796 Printhead assembly with thermal equalization characteristics
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
