Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Alan H. Saikin0
Date of Patent
January 30, 2007
0Patent Application Number
114924430
Date Filed
July 25, 2006
0Patent Primary Examiner
Patent abstract
The present invention provides a polishing pad for performing chemical mechanical planarization of semiconductor substrates. The polishing pad comprises a polishing pad body having an aperture formed therein and a window fixed in the aperture for performing in-situ optical measurements of the substrate. The window has a lower surface capable of transmitting light incident thereon. The lower surface has been treated by laser ablation to remove surface roughness present on the lower surface.
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