Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
January 30, 2007
0Patent Application Number
111282720
Date Filed
May 13, 2005
0Patent Primary Examiner
Patent abstract
A method of plating a circuit pattern on a substrate to produce a circuitized substrate (e.g., a printed circuit board) in which a dual step metallurgy application process is used in combination with a dual step photo-resist removal process. Thru-holes are also possible, albeit not required.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
