Patent 7170373 was granted and assigned to NEC Corporation on January, 2007 by the United States Patent and Trademark Office.
A conductive layer is formed on each of the upper and lower surfaces of a dielectric substrate, and the two conductive layers are connected by rows of via-holes that are formed which a spacing that is less than or equal to ½ of the wavelength in the dielectric substrate in the resonance frequency, whereby n stages of dielectric resonators and input/output waveguide structures are formed. If the number n of stages is assumed to be 3, the first-stage resonator and the second-stage resonator are coupled by an electromagnetic field by means of via-holes of a first spacing; the second-stage resonator and the third-stage resonator are coupled by an electromagnetic by means of via-holes of a second spacing, whereby a filter is formed. The input/output waveguide structure and the filter are coupled by an electromagnetic by means of via-holes of a fourth spacing. The first-stage resonator and the third-stage resonator are coupled by an electromagnetic field by means of via-holes of a third spacing.