US Patent 7172725 W-Cu alloy having homogeneous micro-structure and the manufacturing method thereof

In W—Cu alloy having a homogeneous micro-structure and a fabrication method thereof, the method includes forming mixed powders by mixing tungsten powders with W—Cu composite powders; forming a compact by pressurizing-forming the mixed powders; forming a skeleton by sintering the compact; and contacting copper to the skeleton and performing infiltration. W—Cu alloy having a homogeneous structure fabricated by the present invention shows better performance by being used as a material for high voltage electric contact of a contact braker, a material for heat sink of an IC semiconductor and a shaped charge liner.