Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tsukasa Ohnishi0
Date of Patent
February 6, 2007
Patent Application Number
10682305
Date Filed
October 10, 2003
Patent Citations Received
Patent Primary Examiner
Patent abstract
A lead-free solder which is significantly less susceptible to copper leaching when used in a molten state in which coil ends of copper wire are dipped comprises 1.5–8 mass % of Cu, 0.01–2 mass % of Co, optionally 0.01–1 mass % of Ni, and a remainder of Sn and has a liquidus temperature of 420° C. or below. The solder may further comprise at least one oxidation-inhibiting element selected from the group consisting of P, Ge, and Ga in a total amount of 0.001–0.5 mass %, and/or Ag in an amount of 0.05–2 mass % as a wettability-improving element.
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