Patent attributes
A method for manufacturing a mid-plane. a multi-layer board having a connection assembly is provided and a dielectric layer with a channel formed therein to define a perimeter of a connector area is provided. The dielectric layer is bonded to the multi-layer board such that the connector area overlaps the part of the connection assembly of the multi-layer board. At least a portion of the connector area in the dielectric layer is removed to expose the connection assembly of the multi-layer board. A rigid multilayer is also disclosed. The rigid multilayer includes a multi-layer board and a dielectric layer. The multi-layer board has a connection assembly. The dielectric layer has a channel formed therein to define a perimeter of a connector area. The dielectric layer is bonded to the multi-layer board such that the connector area overlaps the connection assembly of the multi-layer board. The connector area can then be removed such as by depth controlled routing. As will be understood by one skilled in the art, the depth tolerance is not critical because the dielectric layer is pre-formed with the channel prior to formation of the rigid multi-layer.
