Patent 7173220 was granted and assigned to NGK Insulators on February, 2007 by the United States Patent and Trademark Office.
A heating device comprises a substrate having a heating surface, a heating element buried in the substrate, a cylindrical member joined to the substrate, and lead wires for supplying current to the heating element. In addition, the thermal conductivity of the substrate is about 1.0 to about 2.0 times the thermal conductivity of the cylindrical member.