Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
John H. Emadipour0
Gregory S. Novak0
Date of Patent
February 13, 2007
Patent Application Number
11060662
Date Filed
February 16, 2005
Patent Primary Examiner
Patent abstract
A thermoplastic composition used to form resin chips is disclosed. The thermoplastic composition comprises a plurality of particles having a density of 2.2 or greater encapsulated within a thermoplastic resin, where the plurality of particles does not offgas when heated to a temperature of 500° F., and where the thermoplastic resin has a Barcol Hardness of 30 or greater.
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