Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Uwe Seidel0
Carsten Ahrens0
Jakob Huber0
Date of Patent
February 13, 2007
0Patent Application Number
107558440
Date Filed
January 12, 2004
0Patent Primary Examiner
Patent abstract
A method for producing a contact structure on a structured surface comprising producing a first conductive layer on the structured surface, wherein the first conductive layer comprising tungsten. A conductive seed layer is produced on the first conductive layer, the contact structure being produced by electroplating on the seed layer. The first conductive layer serves as an etch stop for selectively removing substrate material from the backside.
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