Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Lakhi Nandal Goenka0
Zhong-You Shi0
Date of Patent
February 13, 2007
Patent Application Number
10189674
Date Filed
July 8, 2002
Patent Citations Received
Patent Primary Examiner
Patent abstract
A multi-layer circuit board with heat pipes and a method for forming a multi-layer circuit board with heat pipes. The method includes forming channels in a first and second pre-circuit assembly and attaching the first pre-circuit assembly to the second pre-circuit assembly such that the channels cooperatively form a heat pipe.
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