US Patent 7177504 Manufacturable connectorization process for optical chip-to-chip interconnects
Patent 7177504 was granted and assigned to Intel on February, 2007 by the United States Patent and Trademark Office.
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An apparatus comprising a substrate having a trench therein, the trench extending to an edge of the substrate, a waveguide array positioned in the trench, the waveguide array extending to the edge of the substrate, and a ferrule attached at or near the edge of the substrate and spanning a width of the waveguide array, the ferrule being directly in contact with a surface of the waveguide array. A process comprising positioning a waveguide in a trench on a substrate, the waveguide extending to an edge of the substrate, and attaching a ferrule at or near the edge of the substrate, the ferrule including a recess having a bottom, wherein the bottom is in direct contact with a surface of the waveguide.
US Patent 07177504 Manufacturable connectorization process for optical chip-to-chip interconnects US Patent 7177504 Manufacturable connectorization process for optical chip-to-chip interconnects
US Patent 07177504 Manufacturable connectorization process for optical chip-to-chip interconnects
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