US Patent 7179503 Method of forming thin metal films on substrates
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Patent Inventor Names
Akira Fukunaga0
Hiroshi Nagasawa0
Takao Kato0
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Patent abstract
A solution containing a metal component of composite ultrafine metal particles each having a core substantially made of metal component and a covering layer made of an organic compound chemically bonded to the core having an average diameter ranging from 1 to 10 nm, uniformly dispersed in a solvent, forms a thin metal film on the surface of a transfer sheet, after which the transfer sheet, after which the transfer sheet is thermally decomposed to transfer the thin metal film to a substrate.
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US Patent 07179503 Method of forming thin metal films on substrates US Patent 7179503 Method of forming thin metal films on substrates
Infobox
Patent Number
071795030
Patent Number
71795030
Edits on 6 Apr, 2023
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Patent Jurisdiction
Patent Number
071795030
Date of Patent
February 20, 2007
0Patent Application Number
104645510
Date Filed
June 19, 2003
0Official Website
Patent Primary Examiner
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US Patent 07179503 Method of forming thin metal films on substrates
Infobox
Is a
Patent jurisdiction
Patent number
07179503
Date of patent
February 20, 2007
Patent application number
10464551
Date Filed
June 19, 2003
Patent primary examiner
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