US Patent 7179682 Packaged device and method of forming same
Patent 7179682 was granted and assigned to Freescale Semiconductor on February, 2007 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
July 27, 2005
Date of Patent
February 20, 2007
Patent Application Number
11191132
Patent Inventor Names
Chee Seng Foong
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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