US Patent 7179743 Titanium underlayer for lines in semiconductor devices
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Patent abstract
A thin Titanium underlayer 22 is included beneath a Titanium rich Titanium Nitride layer 28 in a metal line 20 on a silicon substrate to reduce stress voiding.
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US Patent 07179743 Titanium underlayer for lines in semiconductor devices US Patent 7179743 Titanium underlayer for lines in semiconductor devices
Infobox
Patent Number
0717974300
Patent Number
717974300
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Is a
Patent Jurisdiction
Patent Number
071797430
Date of Patent
February 20, 2007
0Patent Application Number
105106410
Date Filed
January 20, 2003
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
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Infobox
Is a
Patent Jurisdiction
Patent Number
071797430
Date of Patent
February 20, 2007
0Patent Application Number
105106410
Date Filed
January 20, 2003
0Official Website
Patent Primary Examiner
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US Patent 07179743 Titanium underlayer for lines in semiconductor devices
Infobox
Is a
Patent jurisdiction
Patent number
07179743
Date of patent
February 20, 2007
Patent application number
10510641
Date Filed
January 20, 2003
Patent primary examiner
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